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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/23 tsz02201-0r2r0g100280-1-2 4.sep.2012 rev.001 ?2012 rohm co., ltd. all rights reserved. tsz22111 ? 14? 001 datashee t www.rohm.com serial eeprom series standard eeprom wlcsp eeprom BU99901GUZ-W (32kbit) general description BU99901GUZ-W series is a serial eeprom of i 2 c bus interface method. features ? completely conforming to the world standard i 2 c bus. all controls available by 2 ports of serial clock (scl) and serial data (sda) ? other devices than eeprom can be connected to the same port, saving microcontroller port. ? 1.7v to 3.6v single power source action most suitable for battery use. ? fast mode :400khz at 1.7v to 3.6v ? page write mode useful for initial value write at factory shipment. ? auto erase and auto end function at data rewrite. ? low current consumption ? at write operation (3.3v) : 0.6ma (typ.) ? at read operation (3.6v) : 0.6ma (typ.) ? at standby operation (3.6v) : 0.1a (typ.) ? write mistake prevention function ? write (write protect) function added ? write mistake prevention function at low voltage ? compact package ? w(typ.) x d(typ.) x h(max.) : 1.76mm x 1.05mm x 0.35mm ? data rewrite up to 100,000 times ? data kept for 40 years ? noise filter built in scl / sda terminal ? shipment data all address ffh page write product number BU99901GUZ-W number of pages 32byte absolute maximum ratings (ta=25 ) parameter symbol ratings unit remarks impressed voltage v cc -0.3 to +6.5 v permissible dissipation pd 220 mw when using at ta=25 or higher 2.2mw to be reduced per 1 . storage temperature range tstg -65 to +125 action temperature range topr -40 to +85 terminal voltage -0.3 to vcc+1.0 *1 v *1 the max value of terminal voltage is not over 6.5v. memory cell characteristics (ta=25 , vcc=1.7v to 3.6v) limits parameter min. typ. max. unit number of data rewrite times *1 100,000 times data hold years *1 40 years *1 not 100% tested recommended operating ratings parameter symbol rating unit write(ta=-40 to 85 ) 2.7 to 3.3 write(ta=-40 to 70 ) 1.8 to 3.3 supply voltage read(ta=-40 to 85 ) vcc 1.7 to 3.6 v input voltage v in 0 to vcc v
datasheet datasheet 2/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 BU99901GUZ-W (32kbit) electrical characteristics (unless otherwise specified ta=-40 to 85 ?v cc =1.7v to 3.6v) limits parameter symbol min typ. max. unit condition "h" input voltage1 v ih1 0.7vcc vcc+1.0 v 2.5v QvccQ 3.6v "l" input voltage1 v il1 -0.3 0.3vcc v 2.5v QvccQ 3.6v "h" input voltage2 v ih2 0.8vcc vcc+1.0 v 1.8v Qvcc 2.5v "l" input voltage2 v il2 -0.3 0.2vcc v 1.8v Qvcc 2.5v "h" input voltage3 v ih3 0.9vcc vcc+1.0 v 1.7v Qvcc 1.8v "l" input voltage3 v il3 -0.3 0.1vcc v 1.7v Qvcc 1.8v "l" output voltage1 v ol1 0.4 v i ol =3.0ma , 2.5v QvccQ3.6v (sda) "l" output voltage2 v ol2 0.2 v i ol =0.7ma , 1.7v Qvcc2.5v (sda) input leakage current i li -1 1 a v in =0 to vcc (wp, test) pull up resistance i li2 6 14 k (scl,sda) output leakage current i lo -1 1 a v out =0 to vcc (sda) i cc1 4.1 vcc=3.3v , f scl =400khz, twr=5ms byte write, page write current consumption at action i cc2 1.7 ma vcc=3.6v , f scl =400khz random read, current read, sequential read standby current i sb 2.0 a vcc=3.6v, sda ,scl=vcc, wp=gnd action timing characteristics (unless otherwise specified ta=-40 to 85 ?v cc =1.7v to 3.6v) fast-mode 2.5v QvccQ 3.6v standard-mode 1.7v QvccQ 3.6v parameter symbol min. typ. max. min. typ. max. unit scl frequency fscl 400 100 khz data clock "high" time thigh 0.6 4.0 s data clock "low" time tlow 1.2 4.7 s sda, scl rise time *1 tr 0.3 1.0 s sda, scl fall time *1 tf 0.3 0.3 s start condition hold time thd:sta 0.6 4.0 s start condition setup time tsu:sta 0.6 4.7 s input data hold time thd:dat 0 0 ns input data setup time tsu:dat 100 250 ns output data delay time tpd 0.1 0.9 0.2 3.5 s output data hold time tdh 0.1 0.2 s stop condition data setup time tsu:sto 0.6 4.7 s bus release time before transfer start tbuf 1.2 4.7 s internal write cycle time twr 5 5 ms noise removal valid period (sda,scl terminal) ti 0.1 0.1 s wp hold time thd:wp 0 0 ns wp setup time tsu:wp 0.1 0.1 s wp valid time thigh:wp 1.0 1.0 s *1 not 100% tested fast-mode and standard-mode fast-mode and standard-mode are of same actions, and mode is changed. they are distin guished by action speeds. 100khz action is called standard-mode, and 400khz action is called fast-mode. this action frequency is the maximum action frequency, so 100khz clock may be used in fast-mode. when power source voltage goes down, action at high speed is not carried out, therefore, at vcc=2.5v to 5.5v, 400khz, namely, action is made in fastmode. (action is made also in standard-mode) vcc=1.8v to 2. 5v is only action in 100khz standard-mode.
datasheet datasheet 3/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 BU99901GUZ-W (32kbit) sda scl d0 ack stop condition start condition t wr write data(n) sync data input / output timing input read at the rise edge of scl data output in sync with the fall of scl figure 1-(a). sync data input / output timing figure 1-(d). wp timing at write execution figure 1-(b). start - stop bit timing at write execution, in the area from the d0 taken clock rise of the first data(1), to twr, set wp=?low?. by setting wp ?high? in the area, write can be cancelled. when it is set wp=?high? during twr, write is forcibly ended, and data of address under access is not guaranteed, therefore write it once again. figure 1-(e). wp timing at write cancels figure 1-(c). write cycle timing sda sda thd :sta thd :dat tsu :dat tbuf tpd tdh tlow thigh tr tf scl (input) (output) scl sda wp hd wp t wr d1 d0 ack ack data(1) data(n) tsu wp stop condition sda tsu:sta tsu:sto thd:sta start bit stop bit scl thigh:wp wp sda d1 d0 ack ack data(1) data(n) twr scl twr
datasheet datasheet 4/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 BU99901GUZ-W (32kbit) block diagram pin configuration pin descriptions land no. terminal name input / output unit b3 v cc power supply b2 gnd reference voltage of all input / output b1 test input test terminal, connect gnd a3 wp input write protect terminal a2 scl input serial clock input a1 sda input /output slave and word address, serial data input serial data output (bottom view) sda scl wp vcc gnd test a dddress decoder slave - word address register da ta register control circuit high voltage generating circuit power source volta g e detection 12bit 8bit a ck start stop 32kbit eeprom arra y 12bit test terminal, please connect gnd 1 2 3 a b1 test b a1 sda b2 gnd a2 scl b3 v cc a3 wp
datasheet datasheet 5/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) figure 4. l output voltage v ol -i ol (v cc =1.7v) figure 5. l output voltage v ol -i ol (v cc =2.5v) figure 2. h input voltage v ih 1,2 (scl,sda,wp) figure 3. l input voltage v il (scl,sda,wp) typical performance curves (the following values are typ. ones.)
datasheet datasheet 6/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) figure 6. input leak current i li (scl,wp) figure 7. output leak current figure 9. current consumption at read operation icc2 figure 8. cu r rent consumption at write operation icc1 typical performance curves \ continued (fscl=400khz) (fscl=400khz)
datasheet datasheet 7/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) figure 10. current consumption at write operation icc1 (fscl=100khz) figure 11. current consumption at read operation icc2 (fscl=100khz) figure 12. standby current isb figure 13. scl frequency fscl typical performance curves \ continued
datasheet datasheet 8/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) figure 14. data clock high period thigh figure 15. data clock low period tlow figure 16. start condition hold time t hd : sta figure 17. start condition setup time t su : sta typical performance curves \ continued
datasheet datasheet 9/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) figure 18. input data hold time thd:dat(high) figure 19. input data hold time thd:dat(low) figure 20. input data setup time tsu:dat(high) figure 21. input data setup time tsu:dat(low) typical performance curves \ continued
datasheet datasheet 10/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) figure 22. data output delay time tpd0 figure 23. data output delay time tpd1 figure 24. bus open time before transmission tbuf figure 25. internal writing cycle time twr typical performance curves \ continued
datasheet datasheet 11/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) figure 28. noise reduction efection time ti(sda h) figure 29. noise reduction efection time ti(sda l) figure 26. noise reduction efection time ti(scl h) figure 27. noise reduction efection time ti(scl l) typical performance curves \ continued
datasheet datasheet 12/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) figure 30. wp setup time tsu:wp figure 31. wp efective time thigh:wp typical performance curves \ continued
datasheet datasheet 13/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) i 2 c bus communication i 2 c bus data communication i 2 c bus data communication starts by start condition input, and ends by stop condition input. data is always 8bit long, and acknowledge is always required after each byte. i 2 c bus carries out data transmission with plural devices c onnected by 2 communication lines of serial data (sda) and serial clock (scl). among devices, there are ?master? that generates clock and control communication start and end, and ?slave? that is controlled by addresses peculiar to devices. eeprom becomes ?slave?. and the devic e that outputs data to bus during data communication is ca lled ?transmitter?, and the device that receives data is called ?receiver?. figure 32. data transfer timing start condition (start bit recognition) ? before executing each command, start condition (start bit) where sda goes from 'high' down to 'low' when scl is 'high' is necessary. ? this ic always detects whether sda and scl are in start condi tion (start bit) or not, therefore, unless this condition is satisfied, any command is executed. stop condition (stop bit recognition) ? each command can be ended by sda rising from 'low' to 'high' when stop condition (stop bit), namely, scl is 'high' acknowledge (ack) signal ? this acknowledge (ack) signal is a software rule to show whether data transfer has been made normally or not. in master and slave, the device (-com at slave address inpu t of write command, read command, and this ic at data output of read command) at the transmitter (sending) side releases the bus after output of 8bit data. ? the device (this ic at slave address input of write command, read command, and -com at data output of read command) at the receiver (receiving) side sets sda 'low' during 9 clock cycles, and outputs acknowledge signal (ack signal) showing that it has received the 8bit data. ? this ic, after recognizing start condition and slave address (8bit), outputs acknowledge signal (ack signal) 'low'. ? each write action outputs acknowledge signal) (ack signal) 'low', at receiving 8bit data (word address and write data). ? each read action outputs 8bit data (read data), and detects acknowledge signal (ack signal) 'low'. ? when acknowledge signal (ack signal) is detected, and stop condition is not sent from the mast er (-com) side, this ic continues data output. when acknowledge signal (ack signa l) is not detected, this ic stops data transfer, and recognizes stop condition (stop bit), and ends read action. and this ic gets in standby status. device addressing ? output slave address after start condition from master. ? the significant 4 bits of slave address are used for recognizing a device type. the device code of this ic is fixed to '1010'. ? the most insignificant bit ( ` ! ?` `??????? --- ` ! ?` `??????? ) of slave address is used for designating write or read action, and is as shown below. setting ` ! ?` `??????? to 0 --- write (setting 0 to word addr ess setting of random read) setting ` ! ?` `??????? to 1 --- read type slave address BU99901GUZ-W 1 1 1 0 0 0 0 ` ! ?` `??????? 89 89 89 s p condition condition ack stop ack data data addres s start r/w ack 1-7 sda scl 1-7 1-7
datasheet datasheet 14/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) write command write cycle ? arbitrary data is written to eeprom. when to write only 1 by te, byte write normally used, and when to write continuous data of 2 bytes or more, simultaneous write is possible by page write cycle. the maximum number of write bytes is specified per device of each capacity. up to 32 arbitrary bytes can be written. ? data is written to the address designated by word address (n-th address). ? by issuing stop bit after 8bit data input, write to memory cell inside starts. ? when internal write is started, command is not accepted for twr (5ms at maximum). ? by page write cycle, the following can be written in bulk: up to 32 bytes. (refer to "internal address increment in page 15.) ? as for page write command of BU99901GUZ-W, after page select bit(ps) of slave address is designated arbitrarily, by continuing data input of 2 bytes or more, the address of insign ificant 4 bits is incremented internally, and data up to 16 bytes can be written. ? as for page write cycle of BU99901GUZ-W , after the significa nt 7 bits of word address, are designated arbitrarily, by continuing data input of 2 bytes or mo re, the address of insignificant 5 bits is incremented internally, and data up to 32 bytes can be written. 0 0 1 1 0 0 w r i t e s t a r t r / w s t o p 1st word address data slave address 0 d0 a c k sda line a c k a c k wa 11 wa 0 a c k 2nd word address d7 figure 33. byte write cycle w r i t e s t a r t r / w a c k s t o p 1st w ord address(n) sda line a c k a c k data(n+31) a c k slave address 1 0 0 10 0 0 d0 data(n) d0 d7 a c k 2nd w ord address(n) wa 0 wa 11 figure 34. page write cycle
datasheet datasheet 15/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) notes on write cycle continuous input notes on page write cycle list of numbers of page write number of pages 32byte product number BU99901GUZ-W write protect (wp) terminal ? write protect (wp) function when wp terminal is set vcc (h level), data rewrite of all addre ss is prohibited. when it is set gnd (l level), data rewrite of all address is enabled. be sure to connect this te rminal to vcc or gnd, or control it to h level or l level. do not use it open. at extremely low voltage at power on/off, by setting the wp terminal 'h', mistake write can be prevented. during twr, set the wp terminal always to 'l'. if it is set 'h', write is forcibly terminated r / w w r i t e s t a r t a c k s t o p word address (n) data (n) sda line a c k data (n+31) a c k slave address 10 0 1p0 p1 p2 wa 7 d0 d7 d0 a c k wa 0 1 1 00 next command twr (maximum :5ms) command is not accepted for this period. a t s top (stop bit) write starts. s t a r t figure 35. page write cycle the above numbers are maximum bytes for respective types. any bytes below these can be written. in the case of BU99901GUZ-W, 1 page = 32bytes, but the page write cycle write time is 5ms at maximum for 32byte bulk write. it does not stand 5ms at maximum 32byte = 160ms(max.). for example, when it is st arted from address 1eh, therefore, increment is made as below, 1eh 1fh 00h 01h ??? , which please note. * 1eh??? 16 in hexadecimal, therefore, 00011110 becomes a binary number. internal address increment page write mode significant bit is fixed. no digit up wa11 ----- wa5 wa4 wa3 wa2 wa1 wa0 0 ----- 0 0 0 0 0 0 0 ----- 0 0 0 0 0 1 0 ----- 0 0 0 0 1 0 0 ----- 0 1 1 1 1 0 0 ----- 0 1 1 1 1 1 0 ----- 0 0 0 0 0 0 ieh increment --------- ---------
datasheet datasheet 16/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) read command read cycle data of eeprom is read. in read cycle, there are random read cycle and current read cycle. random read cycle is a command to read data by designating address, and is used generally. current read cycle is a command to read data of internal addr ess register without designating address, and is used when to verify just after write cycle. in both the read cycles, sequential read cycle is available, and the next address data can be read in succession. ? in random read cycle, data of designated word address can be read. ? when the command just before current read cycle is random read cycle, current read cycle (each including sequential read cycle), data of incremented last read address (n)-t h address, i.e., data of t he (n+1)-th address is output. ? when ack signal 'low' after d0 is detected, and stop condition is not sent from master (-com) side, the next address data can be read in succession. ? read cycle is ended by stop condition where 'h' is input to ac k signal after d0 and sda signal is started at scl signal 'h'. ? when 'h' is not input to ack signal after d0, seque ntial read gets in, and the next data is output. therefore, read command cycle cannot be ended. when to end read command cycle, be sure input stop condition to input 'h' to ack signal after d0, and to start sda at scl signal 'h'. ? sequential read is ended by stop condition where 'h' is input to ack signal after arbitrary d0 and sda is started at scl signal 'h'. w r i t e s t a r t r / w a c k s t o p 1st word address(n) sda line a c k a c k data ( n ) a c k slave address 10 0 10 0 0 d7 d0 2nd word address(n) a c k s t a r t slave address 10 0 1 a2 a1 r / w r e a d a0 wa 0 wa 11 figure 36. random read cycle figure 37. current read cycle s t a r t s t o p sda line a c k data(n) a c k slave address 10 0 1 0 0 0 d0 d7 r / w r e a d r e a d s t a r t r / w a c k s t o p data ( n ) s da line a c k a c k data ( n+x ) a c k slave address 10 0 1 0 0 0 d0 d7 d0 d7 figure 38. sequential read cycle (in the case of current read cycle) it is necessary to input 'h' to the last ack. it is necessary to input 'h' to the last ack.
datasheet datasheet 17/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) software reset software reset is executed when to avoid malfunction after po wer on, and to reset during command input. software reset has several kinds, and 3 kids of them are shown in the figure below. (refer to figure 39(a), figure 39(b), figure 39(c).) in dummy clock input area, release the sda bus ('h' by pull up) . in dummy clock area, ack output and read data '0' (both 'l' level) may be output from eeprom, therefor e, if 'h' is input forcibly, output may conflict and over current may flow, leading to instantaneous power failure of system power source or influence upon devices. acknowledge polling during internal write, all input commands are ignored, theref ore ack is not sent back. during internal automatic write execution after write cycle input, next command (slave address) is sent, and if the first ack signal sends back 'l', then it means end of write action, while if it s ends back 'h', it means now in writing. by use of acknowledge polling, next command can be executed without waiting for twr = 5ms. when to write continuously, ` ! ?` `??????? = 0, when to carry out current read cycle after write, slave address `! ?` `????? ? = 1 is sent, and if ack signal sends back 'l', t hen execute word address input and data so forth. figure 40. case to continuously write by acknowledge polling slave address word address s t a r t first write command a c k h a c k l slave address slave address slave address data write command during internal write, ack = high is sent back. after completion of internal write, ack=low is sent back, so input next word address and data in succession. t wr t wr second write command s t a r t s t a r t s t a r t s t a r t s t o p s t o p a c k h a c k h a c k l a c k l scl 2 1 8 9 dummy clock9 start figure 39-(b). the case of start+9 dummy clock + start + command input start normal command normal command sda 1 2 13 14 scl figure 39-(a). the case of 14 dummy clock + start + start+ command input normal command normal command dummy clock14 start2 * start command from start input. start9 figure 39-(c). start 9 + command input scl 1 2 3 8 9 7 sda sda normal command normal command
datasheet datasheet 18/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) wp valid timing (write cancel) wp is usually fixed to 'h' or 'l', but when wp is used to canc el write cycle and so forth, pay attention to the following wp valid timing. during write cycle execution, in cancel valid area, by setting wp='h', write cycle can be cancelled. in both byte write cycle and page write cycle, the area from the first start condition of command to the rise of clock to taken in d0 of data(in page write cycle, the first byte data) is cancel invalid area. wp input in this area becomes don't care. set the setup time to rise of d0 taken 100ns or more. the area from the rise of scl to take in d0 to the end of internal automatic write (twr) is cancel valid area. and, when it is set wp='h' during twr, write is ended forcibly, data of address under access is not guarant eed, therefore, writ e it once again.(refer to figure 41.) after execution of forced end by wp standby status gets in, so there is no need to wait for twr (5ms at maximum). figure 41. wp valid timing command cancel by start condition and stop condition during command input, by continuously inputting start condi tion and stop condition, command can be cancelled. (refer to figure 42.) however, in ack output area and during data read, sda bus ma y output 'l', and in this case, start condition and stop condition cannot be input, so reset is not available. therefore, execute software reset. and when command is cancelled by start, stop condition, during random read cycle, sequential read cycle, or current read cycle, internal setting address is not determined, therefore, it is not possible to carry out curre nt read cycle in succession. when to carry out read cycle in succession, carry out random read cycle. figure 42. case of cancel by start, stop condition during slave address input ? rise of d0 taken clock scl d0 ack enlarged view scl sda enlarged view ack d0 ? rise of sda sda wp wp cancel invalid area wp cancel valid area write forced end data is not written. data not guaranteed slave address d7 d6 d5 d4 d3 d2 d1 d0 data twr sda d1 s t a r t a c k l a c k l a c k l a c k l s t o p word address scl sda 1 1 0 0 start condition stop condition
datasheet datasheet 19/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) cautions on microcontroller connection rs in i 2 c bus, it is recommended that sda port is of open drain in put/output. however, when to use cmos input / output of tri state to sda port, insert a series resistance rs between the pull up resistance rpu a nd the sda terminal of eeprom. this is controls over current that occurs when pmos of the microcontroller and nmos of eeprom are turned on simultaneously. rs also plays the role of protection of sd a terminal against surge. therefore, even when sda port is open drain input/output, rs can be used. maximum value of rs the maximum value of rs is determined by following relations. (1) sda rise time to be determined by the capacity (cbu s) of bus line of rpu and sda shoulder be tr or below. and ac timing should be satisfied even when sda rise time is late. (2) the bus electric potential a to be determined by rpu and rs the moment when eeprom outputs 'l' to sda bus should sufficiently secure the input 'l' level (v il ) of microcontroller including recommended noise margin 0.1vcc. maximum value of rs the minimum value of rs is determined by over current at bus collision. when over current flows, noises in power source line, and instantaneous power failure of power source may occur. when allowable over current is defined as i, the following relation must be satisfied. determine the allowable current in consideration of impedance of power source line in set and so forth. set the over current to eeprom 10ma or below. microcontroller r s eeprom figure 44. input/output collision timing ack 'l' output of eeprom 'h' output of microcontroller over current flows to sda line by 'h' output of microcontroller and 'l' output of eeprom. scl sda Q v il v ol 0.1v cc 1.1v cc v il 0.33 0.4 0. 13 r s (v cc v ol )r s + v ol +0.1v cc Q v il r s Q r pu 1010 3 0.835 k ? r pu +r s example when v cc =3v, v il =0.3v cc, v ol =0.4v, r pu =10k ? , 1.13 0.33 Q from(2), r pu=10 microcontroller r s eeprom i ol a bus line capacity cbus v ol v cc v il figure 45. i/o circuit diagram microcontroller eeprom 'l' output r s r pu =10 ? 'h' output over current i figure 46. i/o circuit diagram v cc r s v cc i R Q i r s R 300 ?? example when v cc =3v, i=10ma r s R 3 1010 -3 figure 43. i/o circuit diagram
datasheet datasheet 20/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) i 2 c bus input / output circuit input (scl, sda) input/output (sda) notes on power on at power on, in ic internal circuit and set, vcc rises through unstable low voltage area, and ic inside is not completely reset , and malfunction may occur. to prevent this, functions of po r circuit and lvcc circuit are equipped. to assure the action, observe the following condition at power on. 1. set sda = 'h' and scl ='l' or 'h' 2. start power source so as to satisfy the recommended conditions of tr, toff, and vbot for operating por circuit. recommended conditions of tr,toff,vbot tr toff vbot 10ms or below 10ms or longer 0.3v or below 100ms or below 10ms or longer 0.2v or below 3. set sda and scl so as not to become 'hi-z'. when the above conditions 1 and 2 cannot be obs erved, take the following countermeasures. a) in the case when the above conditions 1 cannot be observed. when sda becomes 'l' at power on. control scl and sda as shown below, to make scl and sda, 'h' and 'h'. b) in the case when the above condition 2 cannot be observed. after power source becomes stable, execute software reset(page17). c) in the case when the above cond itions 1 and 2 cannot be observed. carry out a), and then carry out b). figure 47. input pin circuit diagram figure 48. input /output pin circuit diagram toff tr vbot 0 v cc figure 49. rise waveform diagram tl ow tsu:dat tdh after vcc becomes stable scl v cc sda tsu:dat after vcc becom es stab le vdd figure 50. when scl='h' and sda='l' figure 51. when scl='h' and sda='l'
datasheet datasheet 21/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) low voltage malfunction prevention function lvcc circuit prevents data rewrite action at low power, and prevents wrong write. at lvcc voltage (typ. =1.2v) or below, it prevent data rewrite. vcc noise countermeasures bypass capacitor when noise or surge gets in the power source line, malfunc tion may occur, therefore, for removing these, it is recommended to attach a bypass capacitor (0.1f) between ic v cc and gnd. at that moment, at tach it as close to ic as possible. and, it is also recommended to at tach a bypass capacitor between board vcc and gnd. notes for use (1) described numeric values and data are design repr esentative values, and the values are not guaranteed. (2) we believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further sufficiently. in the case of use by changing the fixed number of external parts, make your decision with sufficient margin in consideration of static characteristics and transition characteristics and fluct uations of external parts and our lsi. (3) absolute maximum ratings if the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded, lsi may be destructed. do not impress voltag e and temperature exceeding the absolute ma ximum ratings. in the case of fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that conditions exceeding the absolute maximum ratings should not be impressed to lsi. (4) gnd electric potential set the voltage of gnd terminal lowest at any action condition. make sure that each terminal voltage is lower than that of gnd terminal. (5) terminal design in consideration of permissible loss in actual use cond ition, carry out heat design with sufficient margin. (6) terminal to terminal shortcircuit and wrong packaging when to package lsi onto a board, pay su fficient attention to lsi direction and displacement. wrong packaging may destruct lsi. and in the case of shortcircuit between lsi terminals and terminals and power source, terminal and gnd owing to foreign matter, lsi may be destructed. (7) use in a strong electromagnetic field may cause ma lfunction, therefore, ev aluate design sufficiently. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority.
datasheet datasheet 22/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) ordering information b u 9 9 9 0 1 g u z - w e 2 part number package guz: vcsp30l1(BU99901GUZ-W) packaging and forming specification e2: embossed tape and reel physical dimension tape and reel information marking diagram vcsp30l1(BU99901GUZ-W) (top view) 9901 part number marking lot number 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (heat sealing method) tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin vcsp30l1(BU99901GUZ-W) s 0.06 s a b ba 0.05 1pin mark 3 0.380.05 6- 0.250.05 1.760.05 2 1 0.2750.05 b 0.35max 1.050.05 a 0.080.05 0.5 p=0.52 (unit : mm) vcsp30l1
datasheet datasheet 23/23 tsz02201-0r2r0g100280-1-2 ? 2012 rohm co., ltd. all rights reserved. 4.sep.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BU99901GUZ-W (32kbit) revision history date revision changes 4.sep.2012 001 new release
datasheet datasheet notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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